PARTNER NEWS: The contactless chips embedded in 2018 Fifa World Cup tickets and the NFC chips in the competition’s Adidas Telstar 18 official match balls have both been supplied by NXP[1], the chip maker has revealed.
“To prevent illicit trading and ticket fraud, and increase overall event security, all official 2018 FIFA World Cup Russia tickets are equipped with NXP’s Mifare Ultralight EV1 contactless IC, a smart radio frequency identification (RFID) chip featuring an authenticity check through a special originality signature,” NXP explains.
“Embedded inside each ticket, the IC stores information about the admission and the ticket’s originality, thus protecting spectators from counterfeits while also providing the Fifa World Cup organizers greater visibility into these grey markets.”
Each of the official match balls, meanwhile, “generates a unique identifier, unlocking exclusive content and information for the consumer. The personalized and location-aware experience displays specific details of each ball and provides access to challenges.”
NXP delivers new security and connectivity to 2018 FIFA World Cup Russia finals with smart stadium experience
Company’s MIFARE delivers smart, contactless experience at world-class events and its NTAG NFC technology powers interactivity within official adidas match ball
MOSCOW, July 12, 2018 — As a pioneer and innovator for smart stadium solutions, NXP Semiconductors NV (NASDAQ:NXPI) today announced that with the use of its MIFARE products, it helps bring secure, contactless ticketing to the ongoing 2018 FIFA World Cup Russia matches including the upcoming final game.
The NXP contactless chip solution inside the match tickets provides fans with fast, hassle-free and safe access to Russia’s spectacular World Cup stadiums. Additionally, the company’s NTAG NFC technology was chosen to enable all new connected experiences with the Official Match Ball, the Adidas Telstar 18. As the most innovative FIFA World Cup ball to date, the NFC
