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By Tom Phillips[2] • Updated nfcw.com[3]

Feig contactless payment terminalFeig contactless payment terminal
PARTNER NEWS: Payment terminal supplier Feig Electronic has selected Cilab[4]’s ci230 high-speed testing solution to help it meet the demands of the latest EMVCo 3.1a specification.

Feig’s cVend payment terminals[5] include a contactless interface and are deployed around the globe in numerous transit and vending applications. They are fully EMVCo certified, meet PCI PTS security requirements and are provided with level 2 kernels for international and domestic card brands.

The company chose Cilab’s solution after benchmark testing and evaluation revealed that the ci230 offered significantly improved times for developing and debugging their latest designs.

The test suite will also allow Feig to fully map the performance of its products before sending them for certification.

The Cilab suite incorporates an IQ modulation test to verify a board’s interoperability and ensure form factor acceptance, especially for payments from mobile devices and wearables.

In addition, the ci230 enables Feig to test a product’s operating volume beyond the minimums set by EMVCo, as well as simulate expanding the operating volume and unexpected load modulation amplitude.

Feig also plans

Read more from our friends at NFC World